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Substrate Packaging Research and Development Engineer
Phoenix, Maricopa County
On-site
Full-time
No salary posted2 days ago- Employment type
- Full-time · On-site
- Posted
- November 12, 2026
Hiring confidence: Sparse posting · 22/100
This posting is missing most of the signals we look for, or shows patterns common to listings that are not actively being filled. Check with the employer before applying. How this is scored
Job Overview
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Job Details: Job Description: As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments. By collaborating with cross-functional teams, you will help shape Intel's next-generation packaging tech…
This role is based in Phoenix, Maricopa County. Intel is hiring for this full-time position through Jobily, where you can check how well your resume matches the posting before you apply.
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