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-Senior Packaging Module Development Engineer
Phoenix, Maricopa County
On-site
Full-time
No salary postedYesterday- Employment type
- Full-time · On-site
- Posted
- November 13, 2026
Hiring confidence: Sparse posting · 22/100
This posting is missing most of the signals we look for, or shows patterns common to listings that are not actively being filled. Check with the employer before applying. How this is scored
Job Overview
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Job Details: Job Description: At Intel, we create world-changing technology that improves the life of every person on the planet. Join Intel's Substrate Packaging Technology Development (SPTD) organization, a global leader in developing advanced substrate and packaging solutions. Our team is dedicated to enabling Intel's roadmap of innovative packaging technologies, focusing on materials development, process optimization and simulation, and process equipment advancements. SPTD supports Intel's …
This role is based in Phoenix, Maricopa County. Intel is hiring for this full-time position through Jobily, where you can check how well your resume matches the posting before you apply.
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