VO
Packaging Engineer- Bump Interconnect
Austin, Travis County
On-site
Full-time
No salary posted2 days ago- Employment type
- Full-time · On-site
- Posted
- November 12, 2026
Hiring confidence: Sparse posting · 22/100
This posting is missing most of the signals we look for, or shows patterns common to listings that are not actively being filled. Check with the employer before applying. How this is scored
Job Overview
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We’re seeking an experienced engineer to lead bump interconnect development for advanced semiconductor devices (2.5D/3D/chiplet/fan-out). This role spans ubump and C4 bump metallurgy, RDL design and plating, chip-side and interposer capture pad design rules, OSAT engagement, reliability, failure analysis, and cross-functional support through package and system productization. Core Responsibilities Own end-to-end bump interconnect development for both ubump (micro-bump) and C4 processes, includi…
This role is based in Austin, Travis County. Volantis Semiconductor is hiring for this full-time position through Jobily, where you can check how well your resume matches the posting before you apply.
About the Company
VO